Business Wire › October 01, 2010
Linked as:Extract
CEA-Leti Makes a R&D 20nm Fully Depleted SOI Process Available Through CMP.
GRENOBLE, France & TOKYO -- CEA-Leti and CMP (Circuits Multi Projets([R])) announced during the FDSOI Workshop at Tokyo University the launch of an Exploratory MPW (Multi Project Wafers) initiative based o...
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